A photopolymerizable resin was closely examined for its capacity as an adhesive via cure advancement in submerged water at cold temperatures. The effects of curing time and temperature were studied by bond strength measurements and extracted monomer quantification with high pressure liquid chromatography. In both cases the cure was performed under water, and there was one wet interface. Both methods showed the progression of the photopolymerization with time and had similar characteristic times. The adhesion strength was measured by lap shear and remained nearly constant over the entire temperature range studied (around 2 MPa for a 2-min cure), while a slight increase in the extracted uncured monomer quantity of one of the resin components was obtained for increasing temperatures.

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