There has been studied to attain a new concept of the whole organic substrate which combines both a new aramid-paper reinforcement and a sophisticated epoxy resin. This reinforcement was based on making the mat of an organic fibre composed of an aromaticpolyether-amide and the impregnated resin of an aromatic amine-adducted epoxy of low volatile type. It must be the meaningful trend for the substrate of future copper-clad laminate to replace the past inorganic reinforcements with an organic ones, finding its way to the progressive surface-mountable use and extending its role, as the next step, to the organic multilayer hybrid-circuit, gathering all the merit of the both past organic and inorganic substrate and also removing the demerit of them accompanied with their cost reduction. So, it should be noted that we are now meeting with the dawn of the next stage of the substrate which continues to expand to both printed and hybrid circuit industry.

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A t s u s h i O k u n o N o r i t a k a O y a r n a , K o i c h i r o u N a g a i , and T s u n e k a z u H a s h i = i o t o -J A P A N R E C C O -, L T D -5 -1 , ~-C~i o m e , D o u~h o , T a k a t s u k i --~1 t y , O s a k a , J A P A N , T E L -8 1 -7 2 6 -6 9 -5 2 3 1 F A X -8 1 -7 2 6 -6 9 -5 2 3 0 ABSTRACT In recentry,flip-chip technology have been very rapidly progressing a t this stage of laboratory. But industry ot tli-chip don t progress with satisfactory. Because it s packaging m a t e r i d s a r e using low viscosity Liquid type undertill epoxy resin, and pdckaging methods a r e using dispenser systems. These systems have many problems t o mass production as hllows.

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