A CMOS burst image sensor reaching 5Mfps with 52 frames in-pixel digital memory has been designed and tested. It fully takes advantage of 3D stacked technology to implement a scalable architecture for 8-bits quantization and data storage at pixel level in CMOS technology. This imager also benefits from backside illumination (BSI) for improved fill factor and wide spectrum sensitivity. A demonstrator has been fabricated, embedding two types of 3D based pixel. In this paper we present the very first experimental test results of 3D stacked in-pixel digital burst image sensor. These results show advantages of using 3D technology to obtain a very high frame rate with both relaxed design conditions and readout timing constraint compared to conventional high speed burst image sensors.
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