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This paper is focused on the creation of bonding on a ceramic substrate medium, which can be applied in 3D structure (LTCC-Low Temperature Co-fired Ceramic), and on the measurement of its reliability. One of the methods which can be used to create a conductive connection between particular layers is described. The method enables to create complex circuitry and to increase the density of entities on the surface. The aim is to create the conductive connection of high reliability, because can not be nondestructive dissolution resultant structure.