R. Dumcke scite author profile

A full electrical characterization of polyimide-copper thin film multilayer on ceramic substrate is presented. Its contain test structures with three different type of ground: continuous solid ground, meshed ground with octogonal holes and with rectangular holes. Electrical performances in terms of impedance, effective permittivity constant, cross talk noises and losses are discussed. The results showed clearly the effects of ground openings on signal transmission.

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Solution of Two-Dimensional Electrostatic and Eddy Current Problems Based on BEM for Modelling of Interconnects on Multichip Modules

Fazelpour

Dumcke

Reichl

1992

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R. Dumcke

Simulation of doping processes

Simulation of Doping Processes

High temperature superconductors-electrical considerations and possible applications in microelectronics

Electrical characterization of interconnects in polyimide-copper thin film multilayer on ceramic substrate

Solution of Two-Dimensional Electrostatic and Eddy Current Problems Based on BEM for Modelling of Interconnects on Multichip Modules

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