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Polyfunctional silylureas were synthesized by the interaction of 3-aminopropyltriethoxysilane with isocyanates of various structures in an inert aromatic solvent. Commercially available diisocyanates such as isophorone diisocyanate, hexamethylene diisocyanate, 2,4-toluene diisocyanate were used as isocyanates. In this case, freshly distilled toluene was used as a solvent. The structures of the obtained compounds were confirmed by the data of IR and NMR1H spectroscopy. Using the synthesized compounds, formulations of compositions for electrodeposition of a tin-indium alloy on a copper wire were developed. The possibility of using silylureas of various structures as effective surfactants used in the electrodeposition of the tin-indium alloy is shown. The operational characteristics of the obtained wire were investigated, including the wire diameter, coating thickness, tensile strength, electrical resistance, and direct current electrical resistivity.

The development of the technique for the manufacture of round copper wire coated with "tin-lead" alloy is considered. The optimal parameters such as the temperature of the "tin-lead" alloy melt, the linear speed for tinning of the wire with a round copper alloy and the diameter of the diamond die were determined. The test results of the experimental wire samples are presented.