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Ion projection microlithography is a technique employing a high-resolution demagnifying ion-optical imaging system in connection with a precision step-and-repeat stage. Design patterns are contained in a self-supporting metal foil of 10× (or 20×) chip size, and are imaged in parallel, chip by chip. A tensile stress is induced in the mask foil such that the mask remains flat and undistorted, when heated by exposure to the ion beam. Different design layers are aligned to better than ±0.1 μm by a system that detects ions backscattered from registration marks.

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