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Experimental devices using patterns of holes etched into semiconductor surfaces are under evaluation for use as neutron detectors. The devices have miniature holes equidistantly spaced so as to completely cover the front surface of a planar semiconductor device. The devices have both electrical contacts and neutron-reactive coatings applied over the surface and within the holes. The tiny via holes assist in thin-film adhesion while offering a method to increase the thermal-neutron detection efficiency.