No abstract

Using a new technique, which we have named the CLEFT process (cleavage of lateral epitaxial films for transfer), we have grown single-crystal GaAs films by vapor phase epitaxy (VPE) on reusable GaAs substrates. A carbonized photoresist mask with narrow, widely spaced stripe openings is first deposited on a (110) GaAs substrate. Epitaxial growth initiated within the openings, followed by lateral growth over the mask, produces a continuous single-crystal GaAs film. The upper surface of the film is bonded to a glass substrate, and the film is then cleaved from the GaAs substrate, leaving the surface of the latter in condition for repeating the procedure. The same GaAs substrate has been used for successive growth of four GaAs films, each about 4 cm2, ranging in thickness from 5 to 10 μm. The electrical properties of a CLEFT film were found comparable to those of conventional VPE layers. The CLEFT process should also be applicable to other semiconductors.

Single-crystal GaAs layers have been obtained by means of lateral epitaxial overgrowth seeded within stripe openings in a SiO2 mask over GaAs layers grown on Ge-coated Si substrates. Transmission electron microscope and scanning cathodoluminescence studies indicate that the laterally overgrown GaAs layers have a dislocation density of less than 104 cm−2, compared to 107–108 cm−2 for the GaAs layers grown directly on the Ge/Si substrates. Initial experiments indicate that the electrical properties of the laterally overgrown layers are comparable to those of conventional GaAs epilayers grown on single-crystal GaAs substrates.