A sensor designer has to keep in mind a couple of things developing a new product. These are performance, reliability and last but not least cost. Cost is mainly a function of yield. To be successful on the market, it is therefore necessary to predict yield for a new design, based on its process steps. This can be done only by modelling a sensor based on process parameters as input to the models. How to realize this, will be shown for the design of a high pressure sensor.

In this contribution we present the basic design of the new miniaturized high pressure sensor chip based on metal thin film technology (MFT). The steps of chip fabrication will be addressed, and compared with alternative processes. The product performance will be demonstrated by characterization data.

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