No abstract

ExpandingNetworks-on-Chip (NoCs) to the third dimension (3D-NoC) has been known as a promising solution for the latency challenges of future many-core Systems-on-Chip. 3D-NoC may take advantages of TSVsfor vertical links which are shorter and faster than horizontal ones. Faults may occur in TSVs as well as the horizontal links though faults inTSVs are more costly. In this paper, we present a fault-tolerant routing algorithm targeting faults in both TSVs and horizontal links. The proposed routing algorithm is based on defining some circular routing paths which offers a deadlock-free routing for packets in meshbased topologies. In addition to tolerating faults, these circular pathshelp in reducing congestion in the centralpart of the network at high injection rates. The proposed circular routing algorithm is able to tolerate all one-faulty links. In addition, it is shown that its performance is better than those of traditional methods.