In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconductor integrated circuits (IC) devices, certain problems occur like wrong Nitrogen (N2) parameter setting on the oven curing machine, with human intervention during setup, causing leadframe oxidation related defects. The paper discussed the importance of automation system on processing semiconductor IC products on die attach curing process, eliminating mostly human intervention on setting up machine parameters, storing and managing programs, restrict unauthorize users from accessing, provide friendly user procedures to prevent human errors and prevent oxidation related defects.

Innovation on die attach curing process on semiconductor industry play a big role to have a robust process eliminating unwanted gross unit rejection. Resolving failures and hardware breakdowns on the exhaust system of oven curing process are the focus of this paper. Discoloration and contamination due to outgas and fumes that cannot exit the oven chamber are the effects of a failed exhaust system. Addressing the said phenomenon showing simulations, trial runs will be discussed on this paper. Promoting an innovative approach that includes real time monitoring of the system performance, and detection of its failure to prevent continuous operation with failed exhaust system are performed to have an appropriate resolution.