The presence of artificial holes in single-grain REBa2Cu3O7−y (RE123, RE: rare-earth elements) bulk superconductors can facilitate oxygen diffusion into superconducting grains through the increased surface area. In addition to the enhancement of oxygen diffusion, the mechanical properties and thermal conductivity of bulk superconductors can be improved by filling holes with a metallic conductive phase. This study presents a new and simple hole-making process for single-grain RE123 bulk superconductors. Artificial holes 3 or 5 mm in diameter were made for Gd1.5Ba2Cu3O7−y (Gd1.5) powder compacts prior to the sintering/melt growth process using specially designed pressing dies. The die pressing neither induced cracking in powder compacts nor influenced thermal procedures for the Gd123 growth. Single-grain Gd1.5 bulk superconductors with holes were successfully fabricated by a top-seeded melt growth (TSMG) process using Gd1.5 powder compacts with holes. The die pressing was proven as a time-saving process in comparison with the conventional method which makes holes in sintered or melt-processed hard bodies by mechanical drilling. The detailed fabrication process of single-grain Gd1.5 bulk superconductor with holes, magnetic levitation forces, and magnetic flux density, estimated for the single-grain Gd123 bulk superconductors with holes, are reported.

For miniaturisation and precision of electronic device, the new technologies such as photoimageable thick film process were combined with conventional thick film process, and constrained sintering with near zero shrinkage in the x and y direction has been proposed. In this research, photoimageable conductive paste for forming embedded components via constrained sintering by low temperature cofired ceramic (LTCC) technology was formulated. Afterwards, by optimising paste formulation, formation process of fine line and sintering method, miniaturised LTCC components especially embedded fine line inductors were fabricated and their properties such as line resolution, surface morphology and yield were investigated. As a result, embedded fine line inductors formed by constrained sintering with fine line resolution of 20 mm and yield over 90% were acquired.