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The junction down mounting attached to a Si-submount with Au-Si solder has been shown to be very reliable for lasers by aging tests of 5 mW at 80° C. The thermal resistance of this junction down mounting is 30 K/W smaller than that of a junction up mounting. Output powers as high as cw 80 mW/stripe, corresponding to 400 mW, was realized without saturation with a five-stripe phase-locked laser array with an inner-stripe configuration assembled on this mounting.

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