Currently Plasma Display Panel (PDP) is the best promising candidate for large area digital display, especially hang-on-thewall digital TVs. Many processes have been developed to manufacture the competitive PDP. We have researched the unique process for fabricating plasma display back panel by the Low Temperature Co-fired Ceramics on Metal (LTCC-M) technology, which is very simple and cost effective manufacturing process [1]. In the year 2000 we presented the evaluation results of 40" LTCC-M plasma display back panel and succeeded in fabricating LTCC-M PDP module [2]. In this paper, we present a new LTCC-M PDP back panel on which the driver ICs are integrated by using LTCC package technology. This new PDP back panel gives us many advantages by directly integrating the driver ICs, which leads to elimination of connection parts and driver IC's circuit boards, enhancing signal speed, reducing the PDP module size and lowering the material cost.