We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer. We realized a fully functional working prototype of Autonomous Wireless Sensor Node system using AJP silver conductive track as an electrical interconnection. IntroductionAerosol Jet Printing (AJP) is an innovative technology for a selective maskless deposition of wide range of materials (conductive, dielectric, biological, nanoparticles etc.) at micron-scale (minimum features of 10µm line and 10µm space are achieved). Because it is a contactless technology, it suits for application on any flat and non-flat, flexible and rigid substrates, and moreover for complex 3D systems. The technology is particularly unique for deposition of a conductive silver paste on plastic substrates. It is known that the organic substrates are particularly sensitive to thermal treatment, as a maximum temperature and time of thermal exposure. AJP silver layer has very low sintering temperature, as low as 100-150°C. The AJP silver layer fine pattern of 10µm line and 10µm space features is reportedly achieved [1][2][3][4][5].That result is much better than a pattern realized by stateof-art a conventional screen printing technology there 100-150µm is an absolute minimum value of line/space features, and it is still better than a 30µm smallest features achieved by inkjet printing [6]. Remarkably, the conventional screen printing and inkjet printing technology are not suitable for 3D application.Despite the advantages listed above the AJP technology remains still a novel technology there number issues must be studied and the technology is not yet widely accepted by industry.

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