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To investigate electrochemical migration (ECM), a relatively new test method has been developed by the authors, which enables real time monitoring of the migration process using microscope observation and insulation resistance measurement under the micro dew condensation environment.This research has focused on studying the dew drop changes and the ECM growth process under micro dew condensation. In addition, we investigated the ECM accceleration factor of each type of test condition using this new method. The results show that the greater the number of test cycles, the more conducive to wetting the surface of the substrate board becomes. When the gap between the electrodes is covered with dew water, the ECM grows into the dew water.

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