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There is stated a choice of a technological mode for diamond abrasion ensuring a required process capacity and silicon carbide plate quality. The correlations of a silicon carbide removal rate with the length of surface micro-cracks with the roughness height of a surface are stated. A procedure is offered for setting technological modes which do not result in plate billet destruction during manufacturing special devices.

Drawbacks in existing methods for rail grinding are analyzed. The innovation technologies for rail tread machining allowing the increase of rail life and rail machining capacity are shown. There are presented basic parameters and indices of the considered working methods taking into account a speed of a rail-working train.