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In the recent past, Quality has increasingly gained in importance in the manufacturing sector on a global scale. Quality Standards like ISO‐9000 series, QS‐9000 series and Malcolm Baldrige National Quality Award have brought on a movement that seems to be gaining momentum by the day. Development of a Total Quality Program for any manufacturing facility must take some key factors into consideration for the program to work. The key factors that need to be considered in a PVC Compounding or a Bottle Blow Molding setup are presented in a generic format to show the merit and applicability to other manufacturing industries. Introductions to some major concepts and tools in Quality Control including Variables. Attributes, Sampling Plans, Cause–Effect Diagrams, Quality Function Deployment, Statistical Process Control and Quality Auditing are presented to measure the efficacy of the Quality Program to achieve Total Quality.

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Submicron high density devices require multilevel interconnections. In multilevel interconnections, issues relating to planarity, stress voiding of metals and stress cracking of the dielectric(s) play an dominant role.As the levels of interconnect go up so does the stress level. A high stress level in the intermediate dielectric can cause cracks which ultimately lead to device failure. In this paper we present a novel method to detect stress cracking using focussed ion beam. This method is correlated with wet chemical etch process and RIE.The phenomenum of cracking of dielectric(s) is studied and different technology aspects are considered. Using the focussed ion beam a robust dielectric is developed.