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In the electronic industry, there is currently a renewed interest in the study of the failure of BGA package and socket solder joints under mechanical stressing, specifically shock and vibration. This means that an analyst now needs to know the proper modeling and test procedures to use in order to better tackle the problem of solder joint reliability under shock and vibration loading. In this paper, an effort has been made to collate the best known methods associated with vibration testing of electronic components mounted on printed circuit boards.

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