This paper reports a sealing process for reliable hermetic wafer-scale packaging among three wafers forming sandwich structure by glass frit. The process could be applied to Si, quartz crystal, SiC wafers and so on. The device wafer is bonded to the capping wafer in the first step and to another capping wafer forming vacuum-cavities in the second step. Experimental results indicate that the average bonding strength of packaging structure reached as high as 0.85kg/mm2 fulfilling MIL-STD-833E standard. The average leakage rate fits the standard of GJB-548A.This paper also realizes glass frit hermetic bonding in the case of Au/Cr and Pt/Ti film feed-through deposited on the device wafer.Experimental results indicate that Pt/Ti film feed-through hold up to bonding temperature cycling and avoid dissolution and adherence reduction compared with Au/Cr film feed-through

This paper reports a novel piezoelectric quartz crystal double-ended tuning fork (DETF) resonator with vibration attenuation structure, which is suitable for high resolution force sensing. The DETF resonator was designed to work in the fundamental flexure mode, and manufactured along the Y direction based on the Z-cut quartz crystal wafer using photolithographic and anisotropic chemical etching of quartz crystal. The resonance frequency of the DETF resonator is 39.1KHz. Vibration amplitude of the DETF resonator was measured and the experimental results show that vibration amplitude of the joint of DETF resonator is almost three orders of magnitude lower than that of midpoint of DETF, and the quality factor is up to 7750 at ambient condition and 59600 in vacuum, respectively.