No abstract

ECM (electrochemical migration)

Different Sn based micro-alloyed solder alloys with manganese content were developed for the electronic industry as a possible cost-effective candidates. The commonly used SnAg3Cu0.5 (SAC305) lead-free solder alloy applied as a reference. As a first step, various technological parameters tested from the solder alloy-manufacturing point of view. During the reliability investigations of the solder alloys, Vickers hardness, tensile strength and shear force tests were carried out. The results show that Mn content SAC alloys are useful in the electronics technology especially in those fields, where the high reliability is not required.