Sharp succeeded the production of high performance LCD using IGZO for the first time in the world. With the extraordinary TFT characteristics, IGZO-TFT LCD can realize (1)lower power consumption and (2)higher touch panel performance than a-Si TFT LCD. In this paper, we report the development of IGZO-TFT and new LCD devices.

HDR 2D‐backlight designs and some process for each of automotive/monitor, mobile device, and future Reality applications are presented. On‐chip lens and confining wall reflector structure are suitable for automotive/monitor applications, and 5,000nits of peak brightness will be performed in real usage. The white LED chip architecture is proposed for mobile applications of 2‐1mm thin backlight. The power efficiency is evaluated to be almost double, and the 500lux ambient light contrast is 5 times larger than a 15.6‐inch OLED display. The 0.5mm thin film backlight with micro‐LED chips for Reality applications is proposed.

Digital Micro Shutter (DMS) Display based on MEMS design and process technologies provides wide color gamut, wide operating temperature range and low power consumption, compared with LCD and OLED which widely are used at the present time. Conventionally, DMS display was driven by LTPS TFT because of its high frequency operation. Oxide TFT as represented by IGZO has higher performance and reliability than a-Si TFT, as well as better productivity for large display than LTPS TFT. The IGZO oxide TFT can be applied to drive DMS display with good performance. It means that uniquely high performance and large size DMS displays can be produced without significant investment.In this paper, technologies and performance of 7 inch diagonal DMS display are explored.

A noncontact interferometric thermometry method based on phase-compensating interferometry is described. Direct frequency monitoring by the reference interferometer connected in parallel to the sensing interferometer provides temperature measurement of high accuracy.

Three-dimensional content addressable memory with optical interconnection (3D-OCAM) has been proposed for the new parallel processing computer system. The 3D-OCAM is used to control the data transfer among many memory iuy"r, of threedimensional memory LSI in this system. The vertical and horizontal data inspection operations among many memory layers are simultaneously implemented. in BD-OCAM. The test chip of 3D-OCAM was fabricated and its basic paralleiinspection operation was successfully demonstrated.