No abstract

Transient response method using isotopically labeled isopropanol was applied to confirm the “pseudo-liquid phase” behavior of the dehydration of isopropanol over H3PW12O40. Results were treated by moment analysis. Under the stationary state of catalytic reaction at 80–90°C, a large amount of isopropanol was present in the bulk and the absorption–desorption process of isopropanol in the whole bulk was much more rapid than its dehydration to propene, demonstrating the “pseudo-liquid phase” behavior.

No abstract

The aim of this study is to create a high reliability solder joint for automotive applications by actively utilizing IMC formation in the joint. The method to disperse pillar-shaped

A pillar shaped intermetallic compounds (IMCs) dispersed solder joint is a highly durable joint to achieve large area joining. The aim of this study is to investigate the ideal dispersion amount of pillar shaped IMCs. The dispersion rate of pillar shaped IMCs depend on the joining temperature. Pillar shaped IMCs dispersion rates are 3.5% and 5.5% when the joining temperature are 300 °C and 330 °C, respectively. Longitudinal elastic modulus are improved by forming pillar shaped IMCs. As a result of examination of the durability by the thermal cycle test, the durability of the joint with the dispersion rate of 3.5% was similar to that without pillar shaped IMCs, while that with the dispersion rate of 5.5% was remarkably improved. In the case of the dispersion rate of 3.5%, pillar shaped IMCs unevenly distributed and cracks tend to progress. On the other hand, in the case of the dispersion rate of 5.5%, pillar shaped IMCs were uniformly dispersed throughout the joint and suppressed crack propagation. Comparison of durability between pillar shaped IMCs solder and indium added solder to verify the effect of pillar shaped IMCs demonstrated that pillar shaped IMCs solder were more durable than indium added solder.