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In the temperature range 600–1000 °C, the effect of material purity on self-diffusion along grain boundaries has been studied in both the pure (Puratronic 99.9945%) and the technical (99.5%) nickel. The penetration profiles were measured by the serial sectioning method using the 63Ni radiotracer. The extensive electron backscatter diffraction (EBSD) analysis was performed on the same samples in order to reveal possible differences in microstructure induced by the impurity content. The obtained microstructure characteristics were further interpreted in terms of the coincidence site lattice (CSL) model.

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