In this study, we evaluated the long-term antifungal effectiveness of 3 types of interior building materials (gypsum board [GB], cement board [CB], and softwood plywood [S-PW]) impregnated with thermally reduced silver nanoparticles supported by titanium dioxide (AgNPs/TiO ) under 95% relative humidity for 4 weeks. AgNPs/TiO was synthesized at 2 thermal reduction temperatures (TRTs, 120 and 200°C) with 2 different AgNP weight percentages (2 and 5 wt%). Four different silver-loading levels (SLLs, 0.025, 0.05, and 0.5 μg/cm and the critical concentration required to inhibit fungal growth on agar plates) and 3 fungal species (Aspergillus niger, Penicillium spinulosum, and Stachybotrys chartarum) were used in the experiments. Higher temperature reduced more ionic Ag to metallic Ag and increased the dispersion of Ag on TiO surface. The 200°C thermally reduced AgNPs/TiO demonstrated excellent antifungal efficiency: Mold growth was almost completely inhibited for 28 days at the low SLL of 0.5 μg/cm . Additionally, AgNPs/TiO exhibited higher antifungal activity on GB and CB than on S-PW. The stepwise regression results indicated that the TRT of AgNPs/TiO (β = -0.739 to -0.51), the SLL (β = -0.477 to -0.269), and the Ag level in the AgNPs (β = -0.379 to -0.136) were the major factors influencing antifungal activity and TRT might be the most significant one.
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