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A novel Antenna‐in‐Package with small size and low profile is designed based on Low Temperature Co‐fired Ceramic technology. In order to realize miniaturization and broadband in antenna part, a novel structure using double fractal antennas and air cavities is applied. A packaging cavity is designed for integrated with usable components and IC chips. The antenna operates at a center frequency of 2.4 GHz and the bandwidth is about 200 MHz. Its maximum gain is 5.6 dBi, and radiation efficiency is above 90% across the frequency passband. By adjusting the dimension parameters, a tradeoff between height and area can be made with its performance parameters constant, therefore the proposed Antenna‐in‐Package can easily adapt to different processes and performance.

An accurate impedance modeling of a multi-stacked on-chip power distributed network (PDN) based on through-silicon-vias (TSVs) is vitally important to estimate the electrical performance in threedimensional integrated circuits (3D ICs). This paper proposed a method for calculating the impedance matrix of the multi-stacked on-chip PDN, which mainly consists of arbitrarily distributed TSVs and grid-type on-chip PDNs. First, a real stack-up structure of a multi-stacked on-chip PDN is separated into discrete components intentionally. Then the equivalent lumped circuit models of all discrete components are assembled into a whole to build the transmission matrix of the multistacked on-chip PDN through the relationship between the nodal voltage and the nodal current. Finally, the impedance matrix can be derived through the transmission matrix . In this paper, the coupling of the arbitrarily distributed TSVs and the distributional effect of the on-chip PDN are considered in the impedance matrix through the transmission matrix method (TMM). The proposed method replaces the simulation of the complex equivalent circuit model with the matrix calculation. It can accurately and quickly calculate the impedance of the multi-stacked on-chip PDN.

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