A copper electroplating using single JGB additive was developed for through silicon via (TSV) filling. The micro-vias were perfectly void-free filled by single JGB additive. The electrochemical analysis demonstrated a "bottom-up" deposition mode by single JGB additive. The "V" shaped filling was attributed to JGB gradient suppressing effect along the micro-via depth. The filled microstructure by single JGB mainly contained fine equiaxed grains while the filled microstructure by PEG-SPS additive contained large columnar grains.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.