Xiaoyan Li scite author profile

In the present work, the creep strain of the composite solder joint is measured using a stepped load creep test on a single specimen. Based on the creep strain tests, constitutive relations for the steady-state creep rate are determined for the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint. In addition, creep strain tests on the Sn-0.7Cu solder joint are performed as a comparison. It is found that the activation energy of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint is higher than that of the Sn-0.7Cu solder joint. At the same time, the stress exponent of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint is higher than that of the Sn-0.7Cu solder joint. It is expected that the creep resistance of the Ag-particle-reinforced Sn-0.7Cu-based composite solder joint will be superior to that of the Sn-0.7Cu solder joint. Finally, the creep deformation mechanisms of the solder joint are discussed.

show abstract

Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies

Wang

2007

Journal of Materials Processing Technology

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Xiaoyan Li

Effect of laser beam welding on tear toughness of a 1420 aluminum alloy thin sheet

Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints

Thermal and tilt effects on bearing characteristics of hydrostatic oil pad in rotary table

Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies

Contact Info

Product

Resources

About