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A planar lightwave circuit (PLC) platform for optoelectronic hybrid integration shows potential for achieving 10 Gbls operation. It uses AuSn bump-type bonding pads on a silica layer to decrease parasitic capacitance, which limited the CR time constant in the optical chip assembly region, and twolayer electrical wiring to reduce parasitic inductance, which caused resonance in the electrical circuit region. An arrayed receiver module fabricated by integrating a two-channel monolithic opto-electronic integrated circuit (OEIC) chip on the PLC platform demonstrated a 3 dB-bandwidth of 8 GHz in both channels, which is equal to the bandwidth of the OEIC chip. This shows the feasibility of using this PLC platform for multichannel 10 Gbls operation. Furthermore, this PLC platform can combine the versatile optical circuit functions of a PLC, such as an arrayed-waveguide grating wavelength multiplexer, with the high-speed signal processing function of mature electronic IC circuits. Consequently, this platform is a key device that will lead to high-capacity optical signal processing systems using optical WavelengtWfrequency routing.

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