The colloidal silver solution was successfully prepared in dielectric fluid by using electrical spark discharge (ESD) without any surfactants. It does not require the toxic chemical agents in the process, which may affect the effectiveness of nanosilver colloid as an antibacterial agent. Nanocolloidal silver produced by ESD is characterized as low cost, zero environmental pollution, continuous, and rapid mass production process. In order to test the effect of antibioactivity, nanosilver dough was tested; the silver nanofluid was prepared by ESD machine, made into dough at different concentrations, and fermented for three hours in order to observe changes in the diameter of the dough. The results showed that the effect of effectiveness of nanosilver at the concentration of 100 ppm was weak, whereas the effect of 60 ppm silver ion (100 ppm AgNO3) was significant, as the dissociation rate of silver ion concentration correlates to the antibioactivity.

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This study selected silver, copper, and titanium as the research objects to explore the relationship between nanofluids properties and electrical discharge machining (EDM) processes. Regarding the products, UV-visible spectroscopy (UV-Vis) was applied to measure the concentration distribution of nanofluids; zeta-size analysis is applied for measuring nanometal particles’ Zeta-Potential and the size distribution of metallic particles in the fluid. Finally, various instruments, including scanning electron microscope (SEM), were applied to observe the shape, size, and composition ratio of metal particles after processing. According to the experimental results, the control of the discharge pulse time, in addition to affecting the concentration of metallic liquid and temperature in the process, affects the size of the metal particles after the process. As the resistivity of silver and copper is very low, at about15×10-9 Ω·m, ifTONis set to between 10~50 μs, good preparation efficiency can be obtained. The resistivity of titanium is420×10-9 Ω·m, which is much larger than that of silver or copper. Hence,TONshould be set to approximately 100 μs to achieve a good discharge success rate.

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