This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness, and wettability of environmentally friendly Sn-20Bi-xAl (x = 0, 0.1, 0.3, 0.5 (wt.%)) solder alloys. Scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS) analysis, and X-ray diffraction (XRD), were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn-20Bi-xAl alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that Al increased the hardness to a maximum value of ~27.1 HV for x = 0.5. When the content of Al was more than 0.3 wt.%, the hardness change value gradually flattened. From the spreading test results, Al reduced the wettability of solder alloys. When the content of Al was 0.1 wt.%, the change was slight. When more than 0.3 wt.%, the wettability of Sn-20Bi-xAl solder alloys sharply dropped. The corrosion resistance of Sn-20Bi-0.1Al alloy was the best, and the corrosion rate was at the lowest value at 0.092 mm/a due to the dense corrosion products.

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Sn-0.7Cu-0.075Al solder alloy adding with Ce and La had been successfully prepared by applying ball-milling and vacuum arc remelting. The influence of Ce and La on microstructure and corrosion behavior of Sn-0.7Cu-0.075Al solder alloy was investigated. The results showed that Ce (La)-containing solders had refined grains and obvious directional tendency due to the dispersive refiner (CeO2 and La2O3). Electrochemical potentiodynamic curves revealed three different stages of the reaction, including anodic and cathodic processes, prepassivation section, and stable passivation stages. The self-corrosion potential (Ecorr) of alloys with Ce and La addition were a little bit more negative, hardly making a difference on corrosion occurrence. However, the corrosion current density (Icorr) and passivation current density (Ip) decreased by two-thirds and one-half respectively, which indicated a better corrosion resistant after adding rare earths. The recorded micrographs of corroded surface at different polarized points witnessed the formation of corrosion product film both on prepassivation and passivation stage. Moreover, the cross section of corrosion product film showed the coarse, loose film in Sn-0.7Cu-0.075Al solder and adherent, compact film in Ce (La)-containing solders, which further indicated an excellent anti-corrosion property.

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