Titanium dioxide (TiO2) displays photocatalytic behavior under near-ultraviolet (UV) illumination. In another scientific field, it is well understood that the excitation of localized plasmon polaritons on the surface of silver (Ag) nanoparticles (NPs) causes a tremendous increase of the near-field amplitude at well-defined wavelengths in the near UV. The exact resonance wavelength depends on the shape and the dielectric environment of the NPs. We expected that the photocatalytic behavior of TiO2 would be greatly boosted if it gets assisted by the enhanced near-field amplitudes of localized surface plasmon (LSP). Here we show that this is true indeed. We named this new phenomenon "plasmonic photocatalysis". The key to enable plasmonic photocatalysis is to deposit TiO2 on a NP comprising an Ag core covered with a silica (SiO2) shell to prevent oxidation of Ag by direct contact with TiO2. The most appropriate diameter for Ag NPs and thickness for the SiO2 shell giving rise to LSP in the near UV were estimated from Mie scattering theory. Upon implementing a device that took these design considerations into account, the measured photocatalytic activity under near UV illumination of such a plasmonic photocatalyst, monitored by decomposition of methylene blue, was enhanced by a factor of 7. The enhancement of the photocatalytic activity increases with a decreased thickness of the SiO2 shell. The plasmonic photocatalysis will be of use as a high performance photocatalyst in nearly all current applications but will be of particular importance for applications in locations of minimal light exposure.

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The interface between filler and matrix has long been a critical problem that affects the thermal conductivity of polymer composites. The effects of the interface on the thermal conductivity of the composite with low filler loading are well documented, whereas the role of the interface in highly filled polymer composites is not clear. Here we report on a systematic study of the effects of interface on the thermal conductivity of highly filled epoxy composites. Six kinds of surface treated and as received AlN particles are used as fillers. Three kinds of treated AlN are functionalized by silanes, i.e., amino, epoxy, and mercapto group terminated silanes. Others are functionalized by three kinds of materials, i.e., polyhedral oligomeric silsesquioxane (POSS), hyperbranched polymer, and graphene oxide (GO). An intensive study was made to clarify how the variation of the modifier would affect the microstructure, density, interfacial adhesion, and thus the final thermal conductivity of the composites. It was found that the thermal conductivity enhancement of the composites is not only dependent on the type and physicochemical nature of the modifiers but also dependent on the filler loading. In addition, some unexpected results were found in the composites with particle loading higher than the percolation threshold. For instance, the composites with AlN treated by the silane uncapable of reacting with the epoxy resin show the most effective enhancement of the thermal conductivity. Finally, dielectric spectroscopy was used to evaluate the insulating properties of the composites. This work sets the way toward the choice of a proper modifier for enhancing the thermal conductivity of highly filled dielectric polymer composites.

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