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Fabrication of nanoelectromechanical systems in single crystal silicon using silicon on insulator substrates and electron beam lithographyWe report a novel microcolumn fabrication method using automated micro-electromechanical-systems (MEMS) assembly. Different microcolumn components, including deflectors, lens elements, and apertures, are fabricated on a highly doped 50 m thick silicon-on-insulator (SOI) wafer. These components with compliant connectors are then assembled onto compliant MEMS sockets fabricated on the same wafer using MEMS NanoEffectors™ and automated assembly. The self-aligning nature of MEMS sockets yields submicron lateral alignment and less than 0.1°angular misalignment. The measured resonant frequency is 593 Hz for first generation assembled components; the footprint of the microcolumn is less than 1 cm 2 . We have successfully built a mechanical prototype microcolumn for technology demonstration and as a proof of concept. Second generation design is under development.

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