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It is well recognized that dimensional scaling has reached its diminishing return phase and the industry is now looking to monolithic 3D to be the future technology driver. This was clearly voiced in the Qualcomm keynote at DAC 2014. This paper will present the game changing impact of the emerging precision bonders, such as EVG's Gemini XT FB. Innovative process flows combined with a 'Smart Alignment' technique could enable any semiconductor vendor to integrate monolithic 3D into its existing manufacturing line and existing process flows with minimal technology challenge. This provides a natural path for product innovation and an unparalleled competitive edge. In sharp contrast, prior published works on monolithic 3D were conditioned on new process flows and new transistor formation recipes. In addition, this game-changer breakthrough offers a very cost competitive flow.

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