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In order to decrease the reflectivity of amplified spontaneous emission, suppress parasitic oscillations, an edge cladding that absorbs the reflected or scattered light is required. The residual stress of the edge cladding is an important parameter for bonding. The influence factors on the residual stress birefringence near the bonding interface are described in detail. The effects of fine annealing, polishing and bonding are investigated. The results indicate that the effects of the edge stress of samples on the residual stress near the bonded interface are in evidence; the poorer of polishing surface flatness makes, the larger birefringence near the cladding interface; and the low shrink percentage and modulus adhesive polymer have less impact for the residual stress near the interface.