2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159730
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0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

Beth Keser
1
,
Rey Alvarado
2
,
M. Philip Schwarz
3
et al.
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