2017 IEEE International Solid-State Circuits Conference (ISSCC) 2017
DOI: 10.1109/isscc.2017.7870340
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13.3 A SAW-less reconfigurable multimode transmitter with a voltage-mode harmonic-reject mixer in 14nm FinFET CMOS

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Cited by 20 publications
(8 citation statements)
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“…15), which is subject to stringent constraints in terms of spurious emissions. In [22] and [23], it is shown that CIM3 can be improved by canceling the signal third harmonic at 3*fc-fBB, which intermodulates with the desired signal at fc+fBB, resulting in spurious emissions at fc-3*fBB, due to non-linearity.…”
Section: Resultsmentioning
confidence: 99%
“…15), which is subject to stringent constraints in terms of spurious emissions. In [22] and [23], it is shown that CIM3 can be improved by canceling the signal third harmonic at 3*fc-fBB, which intermodulates with the desired signal at fc+fBB, resulting in spurious emissions at fc-3*fBB, due to non-linearity.…”
Section: Resultsmentioning
confidence: 99%
“…Recently, the latest designs are fabricated in 16 nm or 14 nm Fin-FET CMOS [4,17]. The corresponding advantages of low voltage operation as well as drastically increased transit frequency and integration density are utilized for the realization of novel circuit design concepts, e.g.…”
Section: Simplified Lte-advanced Transceiver Architecturementioning
confidence: 99%
“…The corresponding advantages of low voltage operation as well as drastically increased transit frequency and integration density are utilized for the realization of novel circuit design concepts, e.g. in [4] where a specialized type of filter-less reconfigurable harmonic rejection mixer has been shown or [17] where a ultra-low power wide-band RX circuit for CA scenarios was demonstrated.…”
Section: Simplified Lte-advanced Transceiver Architecturementioning
confidence: 99%
“…For this reason, analog-intensive transmitter architectures ( Fig. 1(a)) are still very popular and actively researched nowadays [1]- [6]. The main problem with these structures is that they do not significantly benefit from CMOS scaling, thus leading to large area consumption even in the most advanced process nodes.…”
Section: Introductionmentioning
confidence: 99%
“…The main problem with these structures is that they do not significantly benefit from CMOS scaling, thus leading to large area consumption even in the most advanced process nodes. This becomes evident by analyzing the chip micrographs of the circuits published in [1], [3]- [6], from where it can be noticed that the analog baseband section takes up to 50% of the total TX area.…”
Section: Introductionmentioning
confidence: 99%