18‐3: Research on Improving the Back Impact resistance of Flexible OLED Modules

Abstract

This study focuses on the enhancement of back‐impact resistance in flexible OLED modules, a critical aspect for the durability of modern slim‐profile electronic devices. Under rear compressive forces, flexible OLED modules are prone to bending towards the glass cover, placing the outermost touch layer under significant tensile strain. The brittle nature of the inorganic film within the touch layer, coupled with its low fracture elongation, predisposes it to crack initiation under stress. This mechanical vulnerability can lead to catastrophic failure of the OLED functionality due to moisture and oxygen infiltration, manifesting as black spots on the display. Addressing this, we propose a dual‐faceted approach: optimizing stress distribution by the module design and enhancing the tensile strength of the touch layer's inorganic film, achieving a sixfold increase in the module's resistance to back compression. This paper outlines the experimental setup, finite element method (FEM) simulations, and the resultant implications for flexible OLED module design and durability.