2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.357
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3D WL MEMS with Various TSV Technologies' Thermo-Mechanical Analysis

Ying-Te Ou
1
,
Hung-Hsiang Cheng
2
,
Dao-Long Chen
3
et al.
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Performance comparison and analysis by electrical measurement for through-silicon vias (TSV) in wafer level package

Hsieh
1
,
Chen
2
,
Lee
3
et al. 2017
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
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Performance comparison and analysis by electrical measurement for through-silicon vias (TSV) in wafer level package

Hsieh
1
,
Chen
2
,
Lee
3
et al. 2017
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
1
0
0
0
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Stress-strain analysis and optimization of TSV interconnect structure parameters under thermal cyclic load loading based on bp neural network

Wang,
Huang,
Wu
et al. 2023
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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