60 GHz micromachined patch antenna for wireless applications

Lopez, Aida Vera; Papapolymerou, John; Akiba, Akira; Ikeda, Koichi; Mitarai, S.; Ponchak, George E.

doi:10.1109/aps.2011.5996758

Cited by 5 publications

(1 citation statement)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, a second parasitic patch is stacked, mounted on quartz glass, on the first patch that leads to a total antenna efficiency of about 50% at 77 GHz. There are different approaches to enhance the efficiency of such antennas, such as backside micro-machining and/or the addition of an extra dielectric layer on top of the die [4, 5]. Parallel to the ongoing research to improve the performance of AoC concepts, AiP concepts are quite an active topic that can provide a good solution for efficient mm-wave antennas [6, 7].…”

Section: Introductionmentioning

confidence: 99%

Antenna-in-package (AiP) in mm-wave band

Alhenawy

Schneider

2013

Int. j. microw. wirel. technol.

View full text Add to dashboard Cite

We studied the viability of the embedded wafer level ball grid array (eWLB) package environment as an antenna platform for 77 GHz automotive radar sensors and the effects of package fabrication tolerances on the antenna performance. The investigation of different antenna concepts in the eWLB package and their characterization methods are addressed. The design procedures for electrically large, differentially fed loop antennas in a multilayer package structure are introduced. Two different planar antennas are developed and measured in an eWLB package showing promising results such as a gain of 9 GHz and an impedance bandwidth of 8 GHz. An acceptable antenna performance is recorded within the tolerance limits. Therefore, the eWLB package is seen as an appropriate platform for mm-wave antennas and as a good candidate for an antenna-in-package (AiP) concept.

show abstract

Section: Introductionmentioning

confidence: 99%