2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00230
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7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

Yohei Miwa
1
,
Kousei Kumahara
2
,
Sungho Lee
3
et al.
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