2023
DOI: 10.1002/sdtp.16755
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75‐4: Research on Surface Protective Layer of Cu Pad to Improve Welding Capability for MLED

Haifeng Hu,
Ting Zeng,
Caigui Yang
et al.

Abstract: In this paper, by adding Cu alloy or Ni‐Au layer to Cu pad surface reduced the occurrence of pseudo welding and improve the rework strength and promoted the product stability and reliability.

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