A 36-channel parallel optical interconnect module based on optoelectronics-on-vlsi technology

Cook, C.; Cunningham, J. E.; Hargrove, A.; Ger, G.G.; Goossen, K.W.; Jan, W.Y.; Kim, H.H.; Krause, R.; Manges, M.; Morrissey, M.; Perinpanayagam, M.; Persaud, A.; Shevchuk, G.J.; Sinyansky, V.; Krishnamoorthy, Ashok V.

doi:10.1109/jstqe.2003.813306

Cited by 41 publications

(10 citation statements)

References 9 publications

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“…Thus, optical interconnection technology is necessary to realize high-speed data transmission in intracabinet applications such as high-end routers and servers [1][2][3][4][5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector

Suzuki

Ishikawa

Wakazono

et al. 2008

2008 58th Electronic Components and Technology Conference

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We demonstrate 10-Gb/s/ch operations of high-density, low-cost 12-channel optical modules for optical interconnections. These optical modules that we developed are designed to be pluggable into cards with an electrical connector. These pluggable modules will enable cards to be manufactured much more easily since they allow the manufacturing processes of optical modules and cards to be separated. An electrical connector with a clamp spring is used to connect a ceramic substrate with a printed circuit board (PCB). An anisotropic conductive film (ACF) is used to transmit electrical signals between the ceramic substrate and the PCB. To achieve optical coupling, optical fibers are butt-coupled with optical devices mounted in a cavity on the ceramic substrate. Alignment between the twelve optical fibers and the 12-channel optical device is achieved using guide pins fabricated in the ceramic substrate and guide holes fabricated in the optical connector.

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Section: Introductionmentioning

confidence: 99%

10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector

Suzuki

Ishikawa

Wakazono

et al. 2008

2008 58th Electronic Components and Technology Conference

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“…For optical transmitters, VCSELs [1] and MQWMs [2] are the two primary electro-optic transducer candidates for high density optical I/O systems. VCSELs are typically driven with current-mode drivers, since the current directly controls the emitted light.…”

Section: Introductionmentioning

confidence: 99%

High-Speed Transmitters in 90nm CMOS for High-Density Optical Interconnects

Palermo¹,

Horowitz²

2006

2006 Proceedings of the 32nd European Solid-State Circuits Conference

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Abstract-Small, high-speed and low power optical transmitter circuits are needed for optical interconnects to play a role in improving chip I/O bandwidth. This paper demonstrates two different transmitter designs fabricated in a 1V 90nm CMOS technology, one suitable for driving vertical cavity surface emitting lasers (VCSELs) and the other for driving multiple quantum well modulators (MQWMs). A four-tap current summing FIR equalizer extends VCSEL data rate for a given average current. It consumes 80mW at 18Gb/s operation and occupies 0.03mm 2 area. The MQWM transmitter has a pulsedcascode output stage capable of supplying a voltage swing of twice the 1V supply without overstressing thin-oxide core devices. It consumes 38mW at 16Gb/s and occupies 0.014mm 2 area.

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“…All-electrical testing allows the use of standard ATE to be used for testing OE devices. This method has been used for wafer-level testing of lasers [19][20][21][22] and for testing parallel optical interconnect modules [23][24][25]. [8].…”

Section: Introductionmentioning

confidence: 99%

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Thacker

Ogunsola

Bakir

et al. 2005

Advances in Electronic Packaging, Parts A, B, and C

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The bandwidth provided by optical interconnects makes them an attractive solution for chip-to-package and chip-to-chip communications. In such systems, chips will have optical I/O interconnects fabricated alongside their conventional electrical counterparts. Virtually no work has been previously reported relating to the testing of such chips at the wafer-level. The requirements for probe hardware needed to achieve this are identified, and probe module configurations based on these requirements are presented. A high-density micro-opto-electro-mechanical-systems (MOEMS)-based probe substrate prototype for interfacing with chips having electrical and optical polymer pillar-based I/Os has been designed, and built using microfabrication techniques. Successful probing of an array of polymer pillar-based optical I/Os is reported.

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A 36-channel parallel optical interconnect module based on optoelectronics-on-vlsi technology

Cited by 41 publications

References 9 publications

10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector

10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector

High-Speed Transmitters in 90nm CMOS for High-Density Optical Interconnects

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

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A 36-channel parallel optical interconnect module based on optoelectronics-on-vlsi technology

Cited by 41 publications

References 9 publications

10-Gb/s &#x00D7; 12-ch downsized optical modules with electrical conductive film connector

10-Gb/s &#x00D7; 12-ch downsized optical modules with electrical conductive film connector

High-Speed Transmitters in 90nm CMOS for High-Density Optical Interconnects

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Contact Info

Product

Resources

About

10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector

10-Gb/s × 12-ch downsized optical modules with electrical conductive film connector