Abstract:Recent studies of a direct-contact type fingerprint sensor are published [1,2]. Compact, thin-package sensors are needed for remote terminal use. However, as these fingerprint sensors are produced by the standard CMOS process, the chip cost is high. Production costs using low-temperature poly-Si that could produce ICs directly on soda glass substrate would be lower than those using CMOS. A capacitive fingerprint sensor with low-temperature poly-Si TFTs is reported [3]. There charge saved between the finger sur… Show more
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