A Class-G Switched-Capacitor RF Power Amplifier

Yoo, Sang-Min; Walling, Jeffrey S.; Degani, Ofir; Jann, Benjamin; Sadhwani, R.; Rudell, Jacques C.; Allstot, D.J.

doi:10.1109/jssc.2013.2252754

Cited by 132 publications

(112 citation statements)

References 17 publications

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“…Whereas first RF-DAC implementations have been based on current steering DACs, latest designs for operation in the sub-6 GHz bands are usually based on switched capacitor circuits, called C-DACs [11]. One of the main reasons for that is given by the exploitation of precise capacitance ratios and better shrinking capabilities with process technology in comparison to designs based on current steering.…”

Section: Transmittersmentioning

confidence: 99%

Digitally-intensive transceivers for future mobile communications—emerging trends and challenges

Kanumalli

Buckel

Preissl

et al. 2018

Elektrotech. Inftech.

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This article presents an overview of the major trends and challenges involved with the design of multi-band, multi-standard digitallyintensive radio frequency transceivers for next generation mobile communications. In addition, we discuss in detail one aspect of the implementation challenges, namely the occurrence and cancellation of self-interference especially in carrier aggregation modes. For that, we present a novel digital cancellation technique to jointly compensate the self-interference caused by transmit (Tx) modulated spurs and Tx second order intermodulation distortion products (IMD2) in the receiver. This architecture exploits the underlying relation between both types of interference and offers a low-complexity solution to mitigate the Tx-IMD2 interference. Simulation results show, that the proposed technique significantly suppresses both types of interference and restores the signal-to-noise ratio of the wanted signal within 0.3 dB from its value in the absence of interference, thereby achieving 30 dB of cancellation.Keywords: RF; mobile communications; wireless communications; signal processing; interference cancellation; carrier aggregation Digital unterstützte Hochfrequenz-Transceiver für den Mobilfunk der Zukunft -Trends und Herausforderungen. Dieser Artikel gibt zunächst einen Überblick über aktuellen Trends und Herausforderungen bei der Entwicklung von Multi-Band, Multi-Standard HF-Transceivern für die nächste Mobilfunk-Generation, die einen hohen Anteil an digitaler Elektronik aufweisen. Im Anschluss wird im Detail auf ein spezielles Problem solcher Transceiver eingegangen, nämlich der Selbst-Interferenz, die durch den eigenen Sender verursacht wird und die vor allem im Carrier Aggregation-Modus auftritt. Die Problematik wird nicht nur detailliert erklärt, diese Arbeit präsentiert auch eine Methode zur Unterdrückung von Selbst-Interferenz mit den Mitteln der digitalen

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Section: Transmittersmentioning

confidence: 99%

Digitally-intensive transceivers for future mobile communications—emerging trends and challenges

Kanumalli

Buckel

Preissl

et al. 2018

Elektrotech. Inftech.

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“…The SCPA efficiency analysis is presented in detail in [9] and [15]. The MN provides the correct load impedance for the maximum efficiency, contributes to the impedance matching with the next stage and provides a bandpass characteristic in order to filter the square wave V o .…”

Section: Digital Power Amplifier Based Transmittermentioning

confidence: 99%

“…As SCPA implementation presented in [15], working with stacked devices and higher supply voltages can reach peak output power of 25.2 dBm. It uses a 3 V supply in 1.5 V technology.…”

Section: Digital Power Amplifier Based Transmittermentioning

confidence: 99%

Integration solutions for reconfigurable multi-standard wireless transceivers

Kale

Batistell

Popuri

et al. 2018

Elektrotech. Inftech.

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This article presents an overview of modern integration concepts for receiver, transmitter and duplexer architectures. Based on innovative design techniques, a system-in-package integrated RF transceiver architecture is proposed as a low-cost low-power alternative to traditional multi-standard transceivers. The proposed transceiver architecture unites advantages of a sub-sampling receiver with tunable low noise amplifier (LNA), a high-efficiency digital power amplifier and an integrated duplexer with on-package passive components in order to fulfill the more and more stringent requirements for wireless systems. In addition to the transceiver architecture, measurement results of building blocks are presented. A LNA circuit implemented in 65 nm CMOS technology provides a continuously tunable-gain (3-23 dB) and a tunable frequency band (4.5 GHz-5.5 GHz) with noise figure of 2 dB and IIP 3 of −6.5 dBm at the highest gain. A high Q-factor, on-package transformer, implemented in a core-less 3-metal layer system-in-package substrate, presents a coupling factor of 0.6 and a Q-factor of approximately 30. This provides a low-cost, high-performance alternative solution to integrated matching networks and duplexers. IntroductionModern wireless transceivers require multi-band and multi-standard operation, which leads to complex, bulky and power hungry implementations. An architecture for state-of-the-art multi-standard transceiver is shown in Fig. 1, where several transmitter (TX) and receiver (RX) chains are required in order to fulfill specifications for wireless standards.With the evolution of wireless systems, even more communication standards are being proposed while maintaining backward compatibility, therefore, cost and complexity of RF transceivers tend to increase. For high-performance communication standards, external off-chip components with optimized performance such as duplexer filter and power amplifier (PA), are necessary to satisfy ever-growing standard requirements. On the contrary, for low-performance battery operated applications such as Internet of things (IoT), lowpower and low-cost implementations are desired.This article presents a set of innovative design concepts, for receivers, transmitters and system-in-package (SiP) integration, which provides reconfigurability, wide frequency operation, higher power efficiency and low-cost. Based on the presented concepts, an RF transceiver architecture shown in Fig. 2 is proposed. The RX chain is based on a tunable active-balun LNA and a sub-sampling down-

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“…While using a linear PA with large back-off is a standard choice, the digital power amplifier (DPA) gains considerable interest as a possible alternative [1,2,3,4,5]. In [4] and [5], Yoo et al proposed a switched capacitor PA (SCPA) which comprises an array of capacitors that are switched either to the supply voltage or ground at the RF carrier frequency.…”

Section: Introductionmentioning

confidence: 99%

“…In [4] and [5], Yoo et al proposed a switched capacitor PA (SCPA) which comprises an array of capacitors that are switched either to the supply voltage or ground at the RF carrier frequency. The SCPA can be viewed as digitallymodulated envelope elimination and restoration (EER) that achieves high average efficiency with superior linearity.…”

Section: Introductionmentioning

confidence: 99%

Clover shape layout technique in switched capacitor power amplifier for improving drain efficiency

Iwamura

Okazaki

Kumagawa

et al. 2014

IEICE Electron. Express

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In this paper, a new layout technique for improving drain efficiency of the switched capacitor power amplifier (SCPA) is proposed. To minimize the line length from the output capacitors to the output, capacitors and amplifiers are placed around the output pad. This reduces parasitic capacitances and resistances of the output line. Simulation result shows 3% improvement in the drain efficiency. The fabricated test chip achieves 24% drain efficiency at 7 dB back-off while delivering 11 dBm output.

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A Class-G Switched-Capacitor RF Power Amplifier

Cited by 132 publications

References 17 publications

Digitally-intensive transceivers for future mobile communications—emerging trends and challenges

Digitally-intensive transceivers for future mobile communications—emerging trends and challenges

Integration solutions for reconfigurable multi-standard wireless transceivers

Clover shape layout technique in switched capacitor power amplifier for improving drain efficiency

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