A compact flip chip single die WiFi FEM for smart phone application

Yuen, C.; Laursen, K.; Chu, Duc; Pao, Y.C.; Chernyakov, A.; Heide, P.

doi:10.1109/mwsym.2010.5518041

2010 IEEE MTT-S International Microwave Symposium 2010

DOI: 10.1109/mwsym.2010.5518041

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A compact flip chip single die WiFi FEM for smart phone application

C. Yuen

K. Laursen

Duc Chu

et al.

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A compact flip chip single die WiFi FEM for smart phone application

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