A Comparative Study of VLSI 3D Placement for power management and wirelength reduction

Abstract

Abstract-In recent days every application must need power management and area management such physical problems and aspects of VLSI design. Minimization of power and area are highly complex integrated systems in microelectronics have led to the 3 Dimension developments a technological approach. 3 Dimension offers numerous advantages: Size, power consumption, hybrid integration etc., various techniques to handle the power management in IC. Power dissipation in a IC is base on power used by the IC and also by heat dissipation. To reduce energy use or to minimize heat dissipation some of the techniques are available. Three-dimensional (3D) integration is a viable approach that allows designers to add functionality to the devices while maintaining the same die area without the need for new design process. Stack dies in 3D integrated circuits (ICs) also reduces the die area of designs. In addition, die area reduction helps decrease wire length, thus improving the performance of the designs.