A Comprehensive Review on Combinatorial Film via High-Throughput Techniques

Abstract

Numerous technological advancements in the 21st century depend on the creation of novel materials possessing enhanced properties; there is a growing reliance on materials that can be optimized to serve multiple functions. To efficiently save time and meet the requirements of diverse applications, high-throughput and combinatorial approaches are increasingly employed to explore and design superior materials. Among them, gradient thin-film deposition is one of the most mature and widely used technologies for high-throughput preparation of material libraries. This review summarizes recent progress in gradient thin-film deposition fabricated by magnetron sputtering, multi-arc ion plating, e-beam evaporation, additive manufacturing, and chemical bath deposition, providing readers with a fundamental understanding of this research field. First, high-throughput synthesis methods for gradient thin films are emphasized. Subsequently, we present the characteristics of combinatorial films, including microstructure, oxidation, corrosion tests, and mechanical properties. Next, the screening methods employed for evaluating these properties are discussed. Furthermore, we delve into the limitations of high-throughput preparation and characterization techniques for combinatorial films. Finally, we provide a summary and offer our perspectives.

Confined Space Nanoarchitectonics for Dynamic Functions and Molecular Machines

“…The research field of creating and processing materials has developed rapidly since around the 20th century and is still an active research field. Such fields include organic chemistry [59][60][61][62][63], inorganic chemistry [64][65][66][67][68], polymer chemistry [69][70][71][72][73], coordination chemistry [74][75][76][77][78], supramolecular chemistry [79][80][81][82][83], other material sciences [84][85][86][87][88], and biological sciences [89][90][91][92][93]. Detailed control of fine structure is also being carried out.…”