2021 22nd International Conference on Electronic Packaging Technology (ICEPT) 2021
DOI: 10.1109/icept52650.2021.9568026
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A Comprehensive Simulation Study of Warpage of Fan-out Panel-level Package using Element Birth and Death Technique

Yun-Kai Deng
1
,
Bohan Yang
2
,
Wenqian Hu
3
et al.
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